Microelectromechanical systems devices with improved lateral sensitivity
US9612254B2 · kind B2 · utility
3Cited by
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11Claims
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Key dates
| Filing date | Jun 27, 2014 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Jan 19, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0814
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Microelectromechanical system (MEMS) devices and methods for forming MEMS devices are provided. The MEMS devices include a substrate, an anchored structure fixedly coupled to the substrate, and a movable structure resiliently coupled to the substrate. The movable structure has an opening formed therethrough and is positioned such that the anchored structure is at least partially within the opening and is in a capacitor-forming relationship with the movable structure. The movable structure comprises a movable structure finger extending only partially across the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.