Hermetic sealing of optical module
US9612409B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2003 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Sep 1, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4271
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A hermetically sealable package may be formed from a top portion and a bottom portion mated along a seam at or near a plane of an optical fiber. A completed pill assembly may be positioned directly into the enclosure base without requiring the fiber to be threaded through the feed through or “snout”. The top potion may then be mated with the bottom portion to form the package. A glass solder ring may be placed coaxial with the fiber in the feed through. The seam may be sealed by laser welding and the glass solder ring reflowed by laser heating, for example, with a same laser as used to weld the seam or by resistive or induction heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.