Nanoparticle thermal interface agents for reducing thermal conductance resistance
US9613882B2 · kind B2 · utility
2Cited by
4References
13Claims
0Family size
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Key dates
| Filing date | Sep 19, 2016 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Sep 19, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. At least one of the interfacial layers is a vertically aligned metal nanowire array. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.