Electronic interconnects and devices with topological surface states and methods for fabricating same
US9613905B2 · kind B2 · utility
2Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2015 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Oct 21, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.