Method of forming electromagnetic interference shielding layer of ball grid array semiconductor package and base tape for the method
US9613913B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2016 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | May 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a method of forming an electromagnetic interference (EMI) shielding layer of a ball grid array (BGA) semiconductor package, and a base tape used in the method, and more particularly, a method of forming a shielding layer for blocking EMI, on an upper surface and lateral surfaces of a BGA semiconductor package having a lower surface, on which a plurality of solder balls are formed, and a base tape used in the method.According to the method of forming an EMI shielding layer of a BGA semiconductor package, the EMI shielding layer may be formed on the BGA semiconductor package quickly, easily, and effectively by using the base tape, thereby not only improving process productivity but also remarkably reducing the manufacturing costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.