Packaging method for electronic device and packaging system
US9614173B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 16, 2015 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Jul 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/821
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.