Encapsulation method of OLED and a structure of OLED
US9614176B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2014 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Mar 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/00
Abstract
The invention provides an encapsulation method of OLED and a structure of OLED, and the method comprises: step 1: providing a glass cover and an encapsulating substrate, and the glass cover comprising a display area and an edge area surrounding the display area; step 2: forming a layer of SiNx on the edge area of the glass cover; step 3: self-arranging a layer of hydrophobic monomer on the display area surface of the glass cover; step 4: coating a circle of glue frame around the display area on the glass cover; step 5: coating desiccant on the layer of hydrophobic monomer on the display area of the glass cover; step 6: attaching the glass cover correspondingly to the substrate in vacuum environment; step 7: illuminating by UV light to cure the glue frame to achieve the glass cover encapsulating the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.