Multilayer electronic support structure with integral constructional elements
US9615447B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2012 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Jul 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic support structure including at least one pair of adjacent feature layers extending in an X-Y plane that are separated by a via layer; said via layer comprising a dielectric material that is sandwiched between the two adjacent feature layers and at least one constructional element through the dielectric material spanning between said pair of adjacent feature layers in a Z direction perpendicular to the X-Y plane; wherein said at least one constructional element is characterized by having a long dimension in the X-Y plane that is at least 3 times as long as a short dimension in the X-Y plane and wherein the at least one constructional element is fully encapsulated within the dielectric material and is electrically isolated from its surrounding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.