Copper particulate dispersion, conductive film forming method and circuit board
US9615455B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 4, 2012 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Jan 25, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle. The dispersant is a compound having at least one acidic functional group, which has a molecular weight of 200 or more and 100,000 or less, or a salt thereof. Whereby, the dispersant has compatibility with dispersion vehicle and a surface of copper particulates is coated with dispersant molecules, and thus the copper particulates are dispersed in the dispersion vehicle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.