Electronic entity with coupling integrated between a microcircuit and an antenna and method of fabrication
US9615457B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 30, 2014 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Jul 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/18
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic entity includes a module formed of a support film carrying, on an internal face, a microcircuit and a first coupling coil, and a body including a cavity in which this module is fixed, the support film having an external surface running at least approximately alongside an upper surface of this body, and containing an antenna and a second coupling coil connected to this antenna and intended for the coupling of the antenna with the microcircuit by electromagnetic coupling with the first coupling coil; this second coupling coil (likewise may be the case for the antenna and the first coupling coil) is formed on a thickness of at most a few microns in a plane situated, with respect to the upper surface of the body, at a distance of less than half the distance with respect to the surface opposite from this upper surface of this body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.