Method of production of multilayer circuit board
US9615465B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2011 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Apr 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09136
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of production of a multilayer circuit board comprising using a curable composition which contains a heat curable resin and curing agent (I) to form an uncured or semicured resin layer on a board (step A), then bringing a curing agent (II) able to substantially to cure the heat curable resin at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin into contact with the surface of the resin layer, then heating the resin layer at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin and the curing agent (II) can substantially cure the heat curable resin (step B), next heating and curing the resin layer at a temperature at which the curing agent (I) can substantially cure the heat curable resin to form an electrical insulating layer (step C).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.