LED fluorescent cover and preparation method thereof
US9617467B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2014 |
| Grant date | Apr 11, 2017 |
| Priority date | — |
| Expiry date | May 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8511
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A Light Emitting Diode (LED) fluorescent cover comprises the following components by weight: 90-96% of single-component solid silicone rubber, 3-8% of fluorescent powder and 1-2% of vulcanizer; and the preparation method includes the following steps: step 1): using mixed compound of the single-component solid silicone rubber, as well as the fluorescent powder and the vulcanizer as raw material to mix, standing for 2-4 h after mixing with open mill or internal mixer; step 2): controlling temperature, pressure and vulcanization time of vulcanizing machine according to size of the fluorescent cover mold, using the vulcanizing machine to carry out first vulcanization to the raw material that is obtained from the step 1) and placed in the fluorescent cover mold; step 3): with combined action of blower gun, taking the fluorescent cover out slowly; step 4): baking the semi-finished product in a closed space at a temperature of 150-200° C. for 1-2 h.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.