Composition for metal plating comprising suppressing agent for void free submicron feature filling

US9617647B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Cornelia Roeger-Goepfert · Weinheim, DE
• Roman Benedikt Raether · Speyer, DE
• Dieter Mayer · Ludwigshafen, DE
• Alexandra Haag · Ludwigshafen, DE
• Charlotte Emnet · Bad Dürkheim, DE

Key dates

• Filing date: Jul 19, 2010
• Grant date: Apr 11, 2017
• Expiry date: Jul 26, 2030

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D3/40
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A composition comprising at least one source of metal ions and at least one additive obtainable by reacting a polyhydric alcohol comprising at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of the first alkylene oxide and the second alkylene oxide or a third alkylene oxide, a second alkylene oxide, and a first alkylene oxide in aforesaid sequence, the third alkylene oxide having a longer alkyl chain than the second alkylene oxide and the second alkylene oxide having a longer alkyl chain than the first alkylene oxide.