Patent · US Active

Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)

US9620463B2 · kind B2 · utility

7Cited by

7References

29Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Daeik Daniel Kim · San Diego, US
David Francis Berdy · San Diego, US
Mario Francisco Velez · San Diego, US
Changhan Hobie Yun · San Diego, US
Chengjie Zuo · Santee, US
Jonghae Kim · San Diego, US
Matthew Michael Nowak · San Diego, US

Key dates

Filing date	Feb 27, 2015
Grant date	Apr 11, 2017
Priority date	—
Expiry date	Feb 27, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/04105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Ground shielding is achieved by a conductor shield having conductive surfaces that immediately surround individual chips within a fan-out wafer level package (FOWLP) module or device. Intra-module shielding between individual chips within the FOWLP module or device is achieved by electromagnetic or radio-signal (RF) isolation provided by the surfaces of the conductor shield immediately surrounding each of the chips. The conductor shield is directly connected to one or more grounded conductor portions of a FOWLP to ensure reliable grounding.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.