Electronic high frequency device and manufacturing method
US9620854B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 9, 2013 |
| Grant date | Apr 11, 2017 |
| Priority date | — |
| Expiry date | Jan 9, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a wiring board having one or more layers, an integrated circuit arranged on the wiring board, an antenna, and a signal path. The integrated circuit generates a high frequency signal and feeds it to the signal path. The signal path conveys the high frequency signal to the antenna. The antenna emits the high frequency signal into an environment of the electronic device. Alternatively or in addition, the antenna receives the high frequency signal from the environment and feeds it to the signal path. The signal path conveys the high frequency signal to the integrated circuit. The integrated circuit processes the high frequency signal. The signal path includes a wave guide that traverses one or more of the layers of the wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.