Multilayer circuit board
US9622348B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2014 |
| Grant date | Apr 11, 2017 |
| Priority date | — |
| Expiry date | Jul 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09845
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first conductive lands is respectively provided on each of the exposed portions. Each of the second conductive lands is provided on the exposed portion of the outermost substrate, wherein each of the substrates has a conductor pattern to be electrically connected to one of the first conductive lands and to one of the second conductive lands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.