Heat-sink device intended for at least one electronic component and corresponding method
US9622382B2 · kind B2 · utility
1Cited by
9References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 27, 2011 |
| Grant date | Apr 11, 2017 |
| Priority date | — |
| Expiry date | Aug 21, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-sink device intended for at least one electronic component (12), includes: a heat-sink; a substrate (11) for the at least one electronic component (12), said substrate covering the heat-sink; and thermal coupling provided between the substrate and the heat-sink and made from a material different from that of the heat-sink. The heat-sink comprises of a set of independent fins (10), and the thermal-coupling (13) is made from a heat-conductive polymer material and also serve as mechanical coupling between the substrate (11) and the fins (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.