Guide vane and jetting apparatus
US9622395B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 19, 2013 |
| Grant date | Apr 11, 2017 |
| Priority date | — |
| Expiry date | Mar 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3468
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A guide vane has a devised guide configuration for changing a flow direction of molten solder. The guide vane comprises a half-cylindrical plate 11 having a prescribed inner surface shape and a prescribed height, being stood on a prescribed board and changing a flow direction of fluid; and a half-cylindrical plate 12 having a prescribed inner surface shape and a prescribed height, being stood on the board 13 on which the first member 11 is stood and changing the flow direction of the fluid as shown in FIG. 1. The half-cylindrical plate 11 and the half-cylindrical plate 12 are faced so that an inner surface of the half-cylindrical plate 11 is faced to an edge of the half-cylindrical plate 12 and an inner surface of the half-cylindrical plate 12 is faced to an edge of the half-cylindrical plate 11. This structure allows to jet the molten solder to a target place and uniformize a widthwise distribution of the jetting height of the molten solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.