System and method for sub-column parallel digitizers for hybrid stacked image sensor using vertical interconnects
US9622650B2 · kind B2 · utility
27Cited by
336References
27Claims
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Key dates
| Filing date | May 14, 2012 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Apr 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of a hybrid imaging sensor and methods for pixel sub-column data read from the within a pixel array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.