Patent · US Active

Method of encapsulating an electronic component

US9623591B2 · kind B2 · utility

3Cited by

18References

15Claims

0Family size

Assignee

BASF SE

Inventors

Harold Colwell · Midlothian, US
Inga Marie Balke · Wyandotte, US
Lee Ann Dombrowski · Chesterfield Township, US
Richard J. Lair · Long Valley, US
David M. Lange · Monroe, US
Axel Wilms · Bad Dürkheim, DE

Key dates

Filing date	Jan 13, 2014
Grant date	Apr 18, 2017
Priority date	—
Expiry date	Jan 13, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1327
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.