Thickness calibration of an embossing die
US9623623B2 · kind B2 · utility
1Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2012 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Feb 5, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB31F2201/0717
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
There is disclosed a computer program product for carrying out a method of calibrating a thickness of an embossing die, the embossing die being formed from a plurality of ink layers printed by an apparatus. According to the method, an average thickness of an ink layer printed by the apparatus may be calculated, and a target die thickness may be calculated as a function of the average ink layer thickness. A system for implementing a method of calibrating a thickness of an embossing die and a method of measuring a thickness of an embossing die are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.