Chip through flooring material using PLA resin
US9623635B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2011 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Dec 28, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3179
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.