Methods and apparatuses for selective chemical etching
US9624430B2 · kind B2 · utility
0Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2015 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | May 14, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F1/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods, apparatuses and systems are disclosed for chemically etching parts by generating an enclosed chemical etching chamber in contact with a part surface and directing a flow of chemical etchant solution in contact with a part region to be etched.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.