Thermal barrier in building structures
US9624663B2 · kind B2 · utility
3Cited by
20References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 26, 2009 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Feb 21, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249953
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A building structure includes a base structure (10), a thermal barrier layer (20) and an external layer (30). The thermal barrier layer may be a three-dimensional matrix of filaments. The filaments may be irregularly looped and intermingled in a highly porous, three-dimensional structure with a large open space. The filaments form a thermal barrier by reducing the physical contact between the external layer and the base structure. The filament material is low in conductivity, so little heat transfer occurs between the external layer and the filaments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.