Thermal management article and method of forming the same, and method of thermal management of a substrate
US9624779B2 · kind B2 · utility
13Cited by
24References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2013 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Oct 13, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49343
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A thermal management article, a method for forming a thermal management article and a thermal management method are disclosed. Forming a thermal management article includes forming a duct adapted to be inserted into a groove on the surface of a substrate, and attaching the duct to the groove so that the top outer surface of the duct is substantially flush with the surface of the substrate. Thermal management of a substrate includes transporting a fluid through the duct of a thermal management article to alter the temperature of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.