Display substrate and method for repairing lead of driver integrated circuit
US9625779B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 24, 2013 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Feb 26, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/136263
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A display substrate and a method for repairing a lead of a driver integrated circuit. The display substrate comprises: multiple signal leads on the display substrate, at least one driver integrated circuit, at least one repair chip (RC), at least one repair lead, and at least one repair line (13). The RC is connected to the at least one driver integrated circuit, the repair lead is connected to the RC, and the repair line crosses signal lines connected to multiple signal leads, and is insulated from the signal lines. When the signal leads connected to the driver integrated circuit is in poor contact, the repair lead and the repair line (13) are used to replace the signal lead in poor contract, which solves a problem that an existing display substrate cannot repair a signal lead in poor contact in an outer lead region, causing wastes of products, and improving costs of the products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.