Patent · US Active

RFID tag assemblies and process

US9626617B2 · kind B2 · utility

10Cited by

2References

20Claims

0Family size

Assignee

Tagsys SAS · FR

Inventors

Philippe Martin · Herstal, BE
Didier Elbaz · Marseille, FR
Francois Combes · Marseilles, FR

Key dates

Filing date	Sep 30, 2013
Grant date	Apr 18, 2017
Priority date	—
Expiry date	Sep 30, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/10
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A process is disclosed for attaching an RFID tag such as an AK module or QFP package to a flexible surface such as textile or fabric. The process comprises providing a heat fusible label including at least a first layer having a first adhesive layer, a substrate layer including a secondary antenna structure, a heat activated second adhesive layer and a pressure sensitive adhesive (PSA) layer for holding the RFID tag. The process further includes positioning the RFID tag on the PSA layer, pressing the tag against the PSA layer such that the PSA layer holds the tag against the heat fusible label at least temporarily, positioning the heat fusible label with the RFID tag on the flexible surface and applying heat and pressure to the heat fusible label to melt the heat activated layer and to fuse the label to the flexible surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.