Method for removing defective light emitting diode (LED) package from LED package arrary
US9627279B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2014 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Oct 7, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/51
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.