Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus
US9627347B2 · kind B2 · utility
6Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2013 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Aug 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor device according to the present invention comprises:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.