Semiconductor integrated circuit, electronic device, solid-state imaging apparatus, and imaging apparatus
US9627432B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2016 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Mar 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit includes a first semiconductor substrate in which a part of an analog circuit is formed between the analog circuit and a digital circuit which subjects an analog output signal output from the analog circuit to digital conversion; a second semiconductor substrate in which the remaining part of the analog circuit and the digital circuit are formed; and a substrate connection portion which connects the first and second semiconductor substrates to each other. The substrate connection portion transmits an analog signal which is generated by a part of the analog circuit of the first semiconductor substrate to the second semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.