Patterned phosphors in through hole via (THV) glass
US9627437B1 · kind B1 · utility
18Cited by
28References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2016 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Jun 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments are related generally to display fabrication, and more particularly to a fluidic assembly process for the placement of light emitting diodes on a transparent display substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.