Patent · US Active

Method for encapsulating an electronic arrangement

US9627646B2 · kind B2 · utility

4Cited by

11References

22Claims

0Family size

Assignee

tesa SE · DE

Inventors

Jan Ellinger · Hamburg, DE
Thorsten Krawinkel · Hamburg, DE
Klaus Keite-Telgenbüscher · Hamburg, DE
Anja Staiger · Hamburg, DE

Key dates

Filing date	Aug 28, 2009
Grant date	Apr 18, 2017
Priority date	—
Expiry date	Jun 7, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/2835
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.