Power converter package structure and method
US9627972B2 · kind B2 · utility
7Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2015 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Jun 22, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment power converter package comprises a semiconductor die, an output inductor, a plurality of input capacitors and output capacitors. The semiconductor die, the output inductor and the plurality of capacitors are mounted on a lead frame and connected one to another through various pads on the lead frame. The semiconductor die comprises a high side switch, a low side switch and a driver. The power converter package is electrically coupled to an external pulse width modulation controller through a variety of input and output pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.