Resin composition, and prepreg as well as laminate using the same
US9629239B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2012 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Mar 5, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition is provided which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. There is used a resin composition including an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.