Method of manufacturing glass component, glass component, and glass interposer
US9629250B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2015 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Apr 6, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a glass component includes preparing a glass substrate having a thickness greater than or equal to 300 μm, forming first electric wires on a first surface of the glass substrate, forming a structure by joining the glass substrate via a resin layer to a support substrate such that the first surface of the glass substrate faces the resin layer, thinning the glass substrate from a second surface of the glass substrate to a thickness between 10 μm and 80 μm, forming through holes in the glass substrate by irradiating the glass substrate from the second surface with a laser beam, forming second electric wires on the second surface of the glass substrate such that the second electric wires are electrically connected to the corresponding first electric wires via conductors filling the through holes, and separating the glass substrate from the support substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.