Refillable apparatus for aligning and depositing solder columns in a column grid array
US9629259B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2016 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Aug 16, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A disposable apparatus with a plurality of preloaded pins such as solder columns, micro-coil springs, or other cylindrically shaped metallic parts (solder columns, et al.) in an array pattern is provided for aligning and dispensing onto a column grid array (CGA) substrate. The apparatus includes a carrier plate with a pattern of holes that is covered by removable covers to retain, position and hold an array of solder columns, et al. Alignment features on the top of the carrier plate plugs into a jig-alignment fixture or frame that precisely positions the solder columns, et al. over a CGA substrate. After inverting (flipping over) the apparatus and jig-fixture or frame upside down, the payload of solder columns, et al. detaches and transfers by gravity onto a pattern of metal pads on the CGA substrate, without the use of vacuum or vibration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.