Curing agents for low-emission epoxy resin products
US9631047B2 · kind B2 · utility
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4References
14Claims
0Family size
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Key dates
| Filing date | Dec 20, 2013 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Dec 20, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2650/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to curing agents for epoxy resins, containing at least one adduct of a primary diamine and an aromatic monoepoxide, at least one primary diamine and at least one secondary diamine which is free of primary amino groups and free of hydroxyl groups. The curing agent is of low viscosity and cures, together with epoxy resins, rapidly and without blushing, even under damp, cold conditions, to form films of high hardness and low brittleness. It is particularly well suited for low-emission coatings that cure at room temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.