Tungsten-processing slurry with cationic surfactant
US9631122B1 · kind B1 · utility
8Cited by
3References
23Claims
0Family size
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Key dates
| Filing date | Oct 28, 2015 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Oct 28, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F3/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.