Pressure-sensitive adhesive material particularly for encasing an electronic arrangement

US9631127B2 · kind B2 · utility

Assignee

• tesa SE · DE

Inventors

• Klaus Keite-Telgenbüscher · Hamburg, DE
• Jan Ellinger · Hamburg, DE

Key dates

• Filing date: Jul 4, 2013
• Grant date: Apr 25, 2017
• Expiry date: Dec 10, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Pressure-sensitive adhesive material for encasing an electronic arrangement to prevent permeate, which material comprises at least 70 percent by weight of a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, wherein the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer is between 5:95 to 55:45.