Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features

US9631292B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Cornelia Roeger-Goepfert · Weinheim, DE
• Marco Arnold · Ludwigshafen, DE
• Alexander FLUEGEL · Ludwigshafen, DE
• Charlotte Emnet · Bad Dürkheim, DE
• Roman Benedikt Raether · Speyer, DE
• Dieter Mayer · Ludwigshafen, DE

Key dates

• Filing date: May 31, 2012
• Grant date: Apr 25, 2017
• Expiry date: Mar 24, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76898
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A composition comprising a source of metal ions and at least one polyaminoamide, said polyaminoamide comprising amide and amine functional groups in the polymeric backbone and aromatic moieties attached to or located within said polymeric backbone.