Apparatus and method for cleaning deposits and accretions from an end plate of a sensor body
US9632019B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2012 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Oct 20, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/152
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for cleaning deposits and accretions from an end plate of a sensor body, for accommodating a measuring apparatus for determining one or more physical and/or chemical, process variables. The sensor body is sealed against penetration by liquid and a wiper is provided having a wiper blade for cleaning the end plate. The wiper is arranged as a subcomponent on a peripheral, appended module, wherein geometries of the wiper and the peripheral, appended module are so embodied that the wiper in the case of rotary movement from a rest position into a cleaning position, with the lower edge of the wiper blade being flush with the upper edge of the end plate, in the cleaning position, and in order that the wiper cleans the end plate by contact of the wiper blade with the end plate, and the wiper then returns to the rest position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.