Data structure for physical layer encapsulation
US9633053B2 · kind B2 · utility
2Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2014 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Nov 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N21/236
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are a data structure including a header area, and a payload area comprising data, a method of generating the data structure, and extracting information from the data structure. At least one of the header area and the payload area includes at least one sub-area in which one or more signal fields are included. At least one signal field among the signal fields includes information for signalling presence or absence of one or more information fields located at least partly in the data structure, the one or more information fields corresponding to the one or more signal fields.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.