Label for in-mold molding, in-mold molded article and method for molding same
US9633580B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2010 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Nov 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249992
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A label for in-mold molding, which comprises a laminate film comprising a substrate layer (A) and a heat-sealable resin layer (B), wherein the substrate layer (A) comprises a thermoplastic resin in an amount of from 40 to 90% by weight and at least one of an inorganic fine powder and an organic filler in an amount of from 10 to 60% by weight, the heat-sealable resin layer (B) comprises a thermoplastic resin in an amount of from 50 to 100% by weight, the laminate film is at least uniaxially stretched, the porosity of the laminate film is from 10% to 45%, the thermal conductivity of the label is from 0.04 to 0.11 W/mK, and the bonding strength of the label stuck to an adherend formed of a propylene-based resin at 200° C. and 60 MPa is from 250 to 1500 g/15 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.