Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device
US9633848B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2013 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Oct 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a photosensitive resin composition comprising (A) an alkali-soluble resin having a structural unit represented by the following formula (1), (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acryl resin having a structural unit represented by the following formula (2):wherein R1 represents a hydrogen atom or a methyl group; R2 represents an alkyl group having 1 to 10 carbon atoms, or the like; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and the total of a and b is 5 or less, andwherein R3 represents a hydrogen atom or a methyl group; and R4 represents a hydroxyalkyl group having 2 to 20 carbon atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.