Integrated circuit package with active interposer
US9633872B2 · kind B2 · utility
15Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2013 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | May 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package may include a substrate and an interposer. The interposer is disposed over the substrate. The interposer may include embedded switching elements that may be used to receive different power supply signals. An integrated circuit with multiple logic blocks is disposed over the substrate. The switching elements embedded in the interposer may be used to select a power supply signal from the power supply signals and may be used to provide at least one circuit block in the integrated circuit with a selected power supply signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.