Performance enhancement of coating packaged ESC for semiconductor apparatus
US9633884B2 · kind B2 · utility
27Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2013 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Dec 6, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An advanced coating for electrostatic chuck used in plasma processing chamber is provided. The advanced coating is formed using plasma enhanced physical vapor deposition. The coating is generally of Y2O3/Al2O3, although other material combinations can be used. Also, a multi-layered coating can be formed, such that an intermediate coating layer can be formed using standard plasma spray, and a top coating can be formed using PEPVD. The entire ESC assembly can be “packaged” by the coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.