Semiconductor manufacturing device and method of manufacturing semiconductor chip
US9633888B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Feb 17, 2016 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Feb 17, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.