Package structure with an elastomer with lower elastic modulus
US9633919B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2016 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Mar 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a substrate, at least one electronic component, a housing and at least one strut. The at least one electronic component is disposed on a first surface of the substrate. The housing covers the first surface of the substrate. The housing has an accommodation space. The at least one electronic component is accommodated within the accommodation space. The at least one strut is protruded from an inner surface of the housing and extended toward the accommodation space. The at least one elastomer is arranged between the corresponding strut and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.