Semiconductor module
US9633967B2 · kind B2 · utility
1Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2014 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Oct 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/365
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.