Systems and methods for thermally managing high-temperature processes on temperature sensitive substrates
US9634175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2014 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Nov 15, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/541
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for depositing one or more thin-film layers on a flexible polyimide substrate having opposing front and back outer surfaces includes the following steps: (a) heating the flexible polyimide substrate such that a temperature of the front outer surface of the flexible polyimide substrate is higher than a temperature of the back outer surface of the flexible polyimide substrate, and (b) depositing the one or more thin-film layers on the front outer surface of the flexible polyimide substrate. A deposition zone for executing the method includes (a) one of more physical vapor deposition sources adapted to deposit one or more metallic materials on the front outer surface of the substrate, and (b) one or more radiant zone boundary heaters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.